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Shielding Frame
P-3838-K1
01
With the rapid iteration of electronic devices toward miniaturization and high-frequency operation, electromagnetic interference (EMI) has become a critical bottleneck restricting device stability — from signal disruption in mobile RF modules and misjudgment risks in automotive radars to accuracy deviations in medical equipment, all are closely related to EMI. As our flagship high-performance shielding product, the P-3838-K1 builds an all-round invisible protective barrier for various electronic devices.
01
In terms of material, the P-3838-K1 adopts industry-preferred nickel silver, which combines excellent shielding effectiveness and practical cost performance. The nickel silver frame features outstanding solderability, compatible with SMT (Surface Mount Technology) processes. During reflow soldering, it can quickly form a stable connection with solder, ensuring grounding integrity. The stainless steel cover, leveraging high electrical conductivity, attenuates electromagnetic energy through dual mechanisms of reflection and absorption, achieving a shielding effectiveness (SE) of over 85dB. This effectively blocks internal signal leakage and external interference intrusion, perfectly meeting multi-band signal isolation requirements for 2.4GHz WiFi, 5G RF, and more. The tin-plated surface not only solves the soldering challenge of stainless steel but also enhances anti-oxidation capability, extending the product's service life.
01
In structural design, the P-3838-K1 adopts a two-piece snap-fit structure, where the frame and cover fit precisely. This not only facilitates later debugging and maintenance but also effectively prevents component collision risks during transportation. The top of the cover is equipped with a standard φ6.0mm suction cup area, compatible with automatic placement machine pickup needs and significantly improving production efficiency. A 0.3mm component gap is reserved at the edge to accommodate various PCB layout designs. Meanwhile, the embossing process enhances the cover's strength, preventing concave deformation under stress. Additionally, the micro ventilation holes distributed on the cover create an efficient heat dissipation channel without affecting shielding performance, facilitating rapid heat conduction of components and making it suitable for high-temperature scenarios such as laptop CPUs and new energy vehicle BMS (Battery Management Systems).
01
With wide application adaptability, the P-3838-K1 has dimensions precisely matching 38×38mm core circuit areas, making it particularly suitable for optical network terminals (ONTs). During ONT operation, whether isolating optical signal processing modules from power circuits or resisting electromagnetic interference generated by external communication base stations and smart home devices, this shield can achieve the core goal of "no internal interference leakage, no external interference intrusion." It ensures stable data transmission of ONTs and avoids network latency or signal interruption caused by EMI. Furthermore, it can be widely applied in consumer electronics (mobile phones, smart watches), automotive electronics (radar modules, ECUs), industrial control (PLCs, sensors), and medical equipment.
01
From material selection to process details, the P-3838-K1 consistently adheres to the core principles of "high performance, high adaptability, and high reliability," making it an ideal choice for electronic device manufacturers to enhance product stability and competitiveness.